Polysiloxane-Based Organoclay Nanocomposites as Flame Retardants

Abstract

Polydimethylsiloxane-aromatic dianhydride copolymers (PS Oxy-PAA and PS-DAH-PAA) were blended through several techniques with organoclays Cloisite 30B, 10A and Na+ ranging from 1 to 5 wt.%. Thermal and flame-retardant analysis revealed an in-situ blending approach was optimal, which led to the generation of a nanocomposite, PS-Oxy-PAA/30B (5 wt.%), with comparable heat release capacity (170.5 J/g-K) and total heat release (12.0 kJ/g) as seen with some commercial polymers. Concomittant dispersion and FTIR analyses revealed that the enhanced thermal stability observed with PS-Oxy-PAA/30B (5 wt.%) is not dispersion related, since the organoclay was exfoliated in all composites formed. The driving force is the interaction between the carbonyl groups of the PS-Oxy-PAA and the hydroxyl groups of the organoclay, which is limited in all other cases. These results suggest judicious selection of organoclay and siloxane copolymers can faciliate the design of new environmentally safe, heat processible, nonhalogenated alternatives to traditional flame-retardant polymers.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2013
Accession Number
ADA597434

Entities

People

  • Jason W. Soares
  • Jayant Kumar
  • Lian Li
  • Ravi Mosurkal
  • Romy Kirby

Organizations

  • United States Army Soldier Systems Center

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies
  • Human Systems

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Blending
  • Chemistry
  • Combustion
  • Composite Materials
  • Copolymers
  • Dispersions
  • Flame Retardants
  • Materials
  • Materials Science
  • Nanocomposites
  • Physical Properties
  • Plastics
  • Polymer Chemistry
  • Polymers
  • Thermal Properties
  • Thermal Stability

Fields of Study

  • Materials science

Readers

  • Nanocomposite Materials Science
  • Polymer Science and Engineering.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics