Engineered Surface Finishing of HVOF Tungsten Carbide

Abstract

Chemical Mechanical Polishing: Process using slurry (chemical and mechanical), pad (mechanical) and equipment to produce a surface with the desired attributes. Slurry colloidally stable, aqueous solution of ceramic abrasive particles and chemistry. Pad Working surface, generally polymeric. Equipment means of combining the slurry, pad and process parameters to provide consistent results.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2006
Accession Number
ADA600366

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aqueous Solutions
  • Carbides
  • Ceramic Materials
  • Chemical Compounds
  • Chemical Synthesis
  • Chemistry
  • Elements
  • Finishes
  • Manufacturing
  • Materials
  • Polishing
  • Silicon Carbide
  • Silicon Dioxide
  • Surface Finishing
  • Surface Roughness
  • Tungsten
  • Tungsten Carbides

Readers

  • Nanocomposite Materials Science
  • Powder metallurgy of Titanium alloys.
  • Surface Coatings Technology.