Microstructure and Mechanical Properties of Bulk Nanostructured Cu-Ta Alloys Consolidated by Equal Channel Angular Extrusion

Abstract

Nanostructured Cu-Ta alloys have shown promise as high-strength nanocrystalline materials in part due to their limited grain growth at high temperatures. In the present study, Cu Ta alloy powders, synthesized via high-energy cryogenic mechanical alloying, were consolidated into bulk nanostructured specimens using equal channel angular extrusion (ECAE) at high temperatures. Subsequent microstructure characterization indicated full consolidation, which resulted in an equiaxed grain structure for the Cu matrix along with the formation of fine Ta precipitates, the size distributions of which varied both with composition and processing temperature. Microhardness, compression and shear punch testing indicated, in some cases, an almost threefold increase in mechanical properties above that predicted by Hall-Petch estimates for pure nanocrystalline Cu. Stress relaxation tests substantiated the strain-hardening behavior and grain-size-dependent dislocation activity observed in the nanocrystalline Cu Ta samples.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2014
Accession Number
ADA608440

Entities

People

  • K. A. Darling
  • L. J. Kecskes
  • M. A. Tschopp
  • Qiuming Wei
  • R. K. Guduru
  • W. H. Yin

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Composite Materials
  • Crystal Structure
  • Grain Growth
  • Grain Size
  • Hardening
  • Hardness
  • High Energy
  • High Temperature
  • Materials
  • Materials Processing
  • Mechanical Properties
  • Mechanics
  • Molecular Dynamics
  • Particle Size
  • Solid Solutions
  • Strain Hardening
  • Yield Strength

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics