Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

Abstract

A systematic study of the formation and evolution of realistic lead free solder microstructure and the associated deformation properties led to a general materials science based understanding and the development of constitutive laws for selected alloys. A range of different testing of both assemblies and individual solder joints provides for correlations with the microstructure and the definition of different damage functions for isothermal and thermal cycling. Experiments were conducted to ensure the applicability of these functions under typical service conditions.

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Document Details

Document Type
Technical Report
Publication Date
May 05, 2015
Accession Number
ADA621850

Entities

People

  • Peter Børgesen

Organizations

  • Binghamton University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Chemistry
  • Creep
  • Creep Tests
  • Electron Microscopy
  • Failure Mode And Effect Analysis
  • Heat Energy
  • Heat Of Fusion
  • Materials
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Mechanics
  • Test And Evaluation
  • Test Methods
  • Thermodynamics
  • Three Dimensional
  • Two Dimensional

Readers

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