High Breakdown Strength, Multilayer Ceramics for Compact Pulsed Power Applications

Abstract

Advanced ceramics are being developed for use in large area, high voltage devices in order to achieve high specific energy densities (>10 expon 6 J/m3) and physical size reduction. Initial materials based on slip cast TiO2, exhibited a high bulk breakdown strength (BDS >300 kV/cm) and high permittivity with low dispersion (epsilon~100). However, strong area and thickness dependencies were noted. To increase the BDS, multilayer dielectric compositions are being developed based on glass/TiO2,composites. The addition of glass increases the density (~99.8% theoretical), forms a continuous grain boundary phase, and also allows the use of high temperature processes to change the physical shape of the dielectric. The permittivity can also be manipulated since the volume fraction and connectivity of the glassy phase can be readily shifted. Results from this study on bulk breakdown of TiO2 multilayer structures with an area of 2cm* and 0.1 cm thickness have measured 650 kV/cm. Furthermore, a strong dependence of breakdown strength and permittivity has been observed and correlated with microstructure and the glass composition. This paper presents the interactive effects of manipulation of these variables.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1999
Accession Number
ADA639490

Entities

People

  • B. C. Schultz
  • B. Gilmore
  • J. M. Lundstrom
  • L. F. Rinehart
  • M. L. Krogh
  • R. C. Pate
  • S. C. Zhang
  • W. Huebner

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Boundaries
  • Casting (Fabrication)
  • Composite Materials
  • Dielectrics
  • Electrical Properties
  • Grain Boundaries
  • Grain Size
  • High Voltage
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Microstructure
  • Pulsed Power
  • Thickness
  • United States
  • Voltage

Fields of Study

  • Materials science

Readers

  • Mathematics or Statistics
  • Microwave Engineering.
  • Plasma Physics.