Exploratory Development of Processable Laminating Resins With Improved Toughness and Moderate Temperature Capability - Phase 2 and 3

Abstract

A new polyimide resin is developed that provides processing characteristics and basic mechanical properties equivalent to those of commercially available high performance epoxy resins. This new resin, DONA polyimide resin, provides high resistance to moisture thus overcoming a major problem associated with the high performance epoxy resins. An alternative polyimide resin, DAS polyimide resin, is also identified but not developed to the same level as the DONA resin. Fracture toughness studies are performed on DONA/A-S GRAPHITE FIBER COMPOSITES AND COMPARISONS ARE DRAWN WITH EPOXY/A-S graphite fiber composites. Strength retention at 365F of these composites is equivalent to that of high performance epoxy systems.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1974
Accession Number
ADB000374

Entities

People

  • G. A. Zakrzewski
  • M. K. O'rell
  • Robert J. Jones
  • Robert W. Vaughan

Organizations

  • TRW Inc.

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Alcohols
  • Anhydrides
  • Epoxy Resins
  • Fabrication
  • Flexural Strength
  • Governments
  • Heat Energy
  • Infrared Spectra
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Mechanical Properties
  • Mixing
  • Mixtures
  • Polymers
  • Test And Evaluation

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.
  • Systems Analysis and Design