Basic Adhesion Mechanisms in Thick and Thin Films
Abstract
During this quarter, an historical overview of ceramic metallization was undertaken. This included a review of the applications of the technology prior to its utilization in hybrid microcircuits per se. The existing metal-to- ceramic bonding concepts were examined. Appropriate sintering models will be utilized in studying the fundamental aspects of gold thickfilm adhesion in the next quarter. The inorganic chemical analyses of 17 commercial inks were completed. The microstructures of unfired inks have been examined by scanning electron microscopy and have disclosed gold in spherical and hexagonal- triangular platelet form. In addition, the physical and electrical properties of the 17 inks have been characterized on 96 and 99.5 wt pct alumina substrates. This primary parametric study included a ranking of ink performance in terms of printing resolution, adhesion strength (via the peel test method), and electric sheet resistance. In terms of absolute failure load, one reactively bonded gold film exceeded that of all frit-bonded systems. This advantage was maintained even after multiple firing of the film and can be an important property in complex multilevel circuit applications. The lowest sheet resistance, approximately 2 milliohms/square was found in a spherical gold powder-based frit-bonded ink.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 31, 1974
- Accession Number
- ADB001804
Entities
People
- Kenneth R. Bube
- Thomas T. Hitch
Organizations
- Sarnoff Corporation