Reliability Study of Beam Lead Sealed Junction Devices

Abstract

Over 4000 beam lead sealed junction devices, of nine different types, both linear and digital and from four different manufacturers, were physically and electrically characterized. The devices were then sealed (in hermetic and nonhermetic packages) and were environmentally stressed under both operating and nonoperating conditions. Performance was determined and failures categorized according to type, class, complexity, manufacturer, package, and screen.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1975
Accession Number
ADB003569

Entities

People

  • J. J. Mazenko

Organizations

  • Hughes Aircraft Company

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Analysis Of Variance
  • Bench Tests
  • Ceramic Materials
  • Data Analysis
  • Electronics Laboratories
  • Experimental Design
  • Failure Mode And Effect Analysis
  • Information Science
  • Logic Gates
  • Manufacturing
  • Materials
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation
  • Test Equipment
  • Test Methods
  • Transistors

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