Exploratory Development of Processable Laminating Resins with Improved Toughness and Moderate Temperature Capability. Volume 3, Phase 2 and 3
Abstract
Resin optimization studies and adhesive development work were continued with the DONA polyimide resin developed under Phase I of this program. Objectives of the Phase II and III studies during this twelve-month period were to identify a lower boiling solvent than DMF or NMP and to develop an adhesive using the DONA polyimide resin. The PMR approach (polymerization of monomeric reactants) was evaluated as a route to obtaining resin stability in low boiling solvents. It was demonstrated that the use of DMF is key to obtaining sufficient imidization prior to cure at 400 F. Attempts to develop an adhesive using the DONA polyimide resin were unsuccessful.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1976
- Accession Number
- ADB011456
Entities
People
- C. H. Sheppard
- M. K. O'rell
- R. W. Vaughan
Organizations
- TRW Inc.