Electronic Equipment Cold Plates

Abstract

Experimental and analytical work have been performed to investigate capabilities and thermal performance characteristics of cold plates for electronic equipment cooling. The effort includes air-cooled cold plates, liquid-cooled cold plates, and cold plates provided with heat pipes. Different designs were selected for each of the three categories and thermal tests at different coolant flow and equipment power dissipation rates performed. It has been shown that large amounts of equipment waste heat can be removed by this cooling technique, and thermal performance accurately predicted, particularly with computer-aided analysis.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1976
Accession Number
ADB013904

Entities

People

  • Carl J. Feldmanis

Organizations

  • Flight Dynamics Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aircrafts
  • Climate Change
  • Electronic Components
  • Electronic Equipment
  • Heat Capacity
  • Heat Energy
  • Heat Of Vaporization
  • Heat Pipes
  • Heat Transfer
  • Latent Heat
  • Lepidoptera
  • Mechanics
  • Semiconductor Devices
  • Temperature Gradients
  • Test And Evaluation
  • Test Equipment
  • Thermodynamics

Fields of Study

  • Engineering

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems