Cure Monitoring Techniques for Adhesive Bonding Processes

Abstract

Dielectric monitoring was successfully applied to the adhesive bonding process for structural aerospace adhesives. Of the three methods investigated, the one best suited for production applications was demonstrated for flat adherends of various substrates and aluminum honeycomb panels. A monitoring technique which uses a foil probe embedded in the bondline permits multipoint cure monitoring in a single bondline. Effects of the probe on bondline strength were determined.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1977
Accession Number
ADB021841

Entities

People

  • A. Wereta Jr.
  • C. A. May
  • J. S. Fritzen

Organizations

  • Lockheed Martin Missiles and Space

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesive Bonding
  • Adhesives
  • Aluminum
  • Chemical Kinetics
  • Composite Materials
  • Epoxy Composites
  • Flexural Properties
  • Honeycomb Cores
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Metals
  • Monitoring
  • Test And Evaluation

Readers

  • Plasma Physics.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Space