Nondestructive Inspection (NDI) of Glass-to-Metal Seals in Hybrid Packages.

Abstract

The objective of this study was to investigate improved and simplified methods for nondestructive testing of unlidded microcircuit packages. A specific objective was to evaluate penetrant gases which would react chemically with organic compounds to produce colored dyes. Though several gas/dye systems were found to produce the desired colored changes, none was sensitive in detecting leak rates, even of the order of 1 x .000001 std cc/sec or less.

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1983
Accession Number
ADB073233

Entities

People

  • Bernard L. Weigand
  • Harold Goldfarb
  • J. J. Licari

Tags

DTIC Thesaurus Topics

  • Inspection
  • Metal Seals
  • Microcircuits
  • Nondestructive Testing
  • Organic Compounds

Readers

  • Chemistry (specifically Chemical Fluorescence)
  • Structural Health Monitoring of Composite Structures.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics