Thermal Resistances of Joint Army Navy (JAN) Certified Microcircuit Packages

Abstract

The actual thermal resistance value of Joint Army Navy (JAN) certified microcircuit packages was determined. The thermal resistance from the junction to the case (theta sub jc) was used to characterize the JAN packages. A thermal chip with uniform heating was used for the thermal testing. The thermal chip eliminates much of the ambiguity of thermal testing and is the recommended method for thermal characterization of packages. Thermal resistance values were obtained from over 2,000 tests on various integrated circuit packages assembled and provided by 20 manufacturers. The majority of the tests were performed using .060 inch by .060 inch thermal test chips, simulating small scale integration, attached with a gold silicon eutectic. Selected tests using larger die, simulating medium and large scale integration, and silver glass die attachment were also performed. The thermal resistance data has been tabulated and is reported by type of package construction.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1986
Accession Number
ADB108417

Entities

People

  • Ralph M. Mindock

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Circuit Boards
  • Department Of Defense
  • Diagrams
  • Electronics
  • Electronics Industry
  • Failure Mode And Effect Analysis
  • Heat Sinks
  • Integrated Circuits
  • Large Scale Integration
  • Materials
  • Measurement
  • Regression Analysis
  • Semiconductors
  • Statistical Analysis
  • Test And Evaluation
  • Test Equipment
  • Thermal Resistance

Fields of Study

  • Engineering

Readers

  • Materials Science and Engineering.
  • Reinforced Composite Materials
  • Software Engineering

Technology Areas

  • Microelectronics