Optical Input/Output (I/O) 'Pin' and 'Pin' Grid Arrays for Multichip Module (MCM) Inter-Layer and External Connectivity.
Abstract
The increased complexity of electronic circuits and reduced component sizes has resulted in large numbers of Input/Output (I/O) interconnections for each module layer. However, the number of electrical interconnects that can be placed at module layer edges is limited. In addition, electrical interconnects are sensitive to external electromagnetic interference and interchannel electrical cross talk. In response to these issues, Physical Optics Corporation (POC) evaluated a new optical I/O 'pin' and pin grid array concept for two dimensional interlayer interconnects and system I/O. POC's concept is based on commercially available fibers, optical lenses, vertical cavity surface emitting lasers, and highly sensitive photodiode arrays. The advantages of the optical 'pin' concept include high data rate I/O (>GHz speeds), low loss, low signal propagation delay, high immunity to Electromagnetic Interference (EMI), low cross talk at high speeds, high 'pin' count (200/cm2 to 2500/cm2), and low cost.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1996
- Accession Number
- ADB211505
Entities
People
- Freddie Lin