Multifunctional Structural Electronics Packaging.

Abstract

This project demonstrated the feasibility of developing a highly integrated multifunctional component that would enable Multichip Modules (MCMs) to be mounted directly to the surface of a spacecraft panel. The benefits of this concept over conventional black box technology are: >90% weight savings, >90% volume savings, >70% surface area savings, better thermal path for waste heat rejection, and elimination of extensive amounts of cabling. This concept for packaging is essential if small spacecraft are going to be developed and deployed. 500 kgs spacecraft that require high levels of electronic data processing cannot be developed using conventional black box technology; the new millenium spacecraft require this technology to achieve the mission goals. The results demonstrated that a multifunctional component that has the correct CTE, high thermal conductivity, high stiffness, and lightweight can be manufactured.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1995
Accession Number
ADB211506

Entities

People

  • William E. Davis

Tags

Communities of Interest

  • Advanced Electronics
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Carbon Carbon Composites
  • Carbon Fibers
  • Circuit Boards
  • Composite Materials
  • Conductivity
  • Contractors
  • Department Of Defense
  • Electronic Components
  • Electronics
  • Fabrication
  • Government Procurement
  • Governments
  • Heat Transfer
  • Printed Circuits
  • Silicon Carbide
  • Thermal Conductivity
  • Three Dimensional

Readers

  • Integrated Circuit Design and Technology.
  • Reinforced Composite Materials
  • Software Engineering

Technology Areas

  • Microelectronics
  • Space
  • Space - Spacecraft Maneuvers