Affordable, Lightweight, Highly Conductive Polymer Composite Electronic Packaging Structures
Abstract
The objective of this proposed SBlR research project is to develop the technology which will enable the production of affordable, lightweight, highly conductive polymer composite electronic packaging (i.e., electronic housings and heat sinks). The research will center on predominately polymer matrix composite materials and how various material designs can be utilized in various structural/thermal configurations to produce electronic housings and heat sinks that exceed the performance requirements of current aluminum electronic housings and metallic heat sinks (and at one-half the weight). The applications of this technology are very suited to commercial satellites as well as aircraft avionics, and shipboard and field electronic packaging. This technology has the capability of displacing aluminum for thermal/structural applications.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1996
- Accession Number
- ADB215674