Bonding Material for Planar Electronic Device.

Abstract

The patent application relates to a composition for bonding integrated circuits to a heat sink and conducting heat therebetween. The composition is comprised of a thermoplastic polymer resin adhesive for supplying the bonding strength, a solvent for softening the adhesive to a putty like substance, and a filler for increasing the thermal conductivity of the adhesive.

Document Details

Document Type
Technical Report
Publication Date
May 22, 1974
Accession Number
ADD001893

Entities

People

  • Marvin L. Fredberg

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Circuits
  • Composite Materials
  • Conductivity
  • Films
  • Heat Sinks
  • Integrated Circuits
  • Materials
  • Patent Applications
  • Patents
  • Plastics
  • Polymers
  • Reinforcing Materials
  • Resins
  • Thermal Conductivity
  • Thermoplastic Resins

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Polymer Science and Technology
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics