Method for Making Beam Leads.

Abstract

The patent application relates to a method for making beam leads for use in the interconnecting of electronic packages to a substrate. Metal foil, such as copper, is etched to form a plurality of beam leads and then a second metal having poor adhesion with said metal foil is deposited onto the metal foil. The second metal is then separated from the metal foil and the metal foil is reuseable as a depository for another deposition of the second metal which is the desired beam leads.

Document Details

Document Type
Technical Report
Publication Date
Oct 17, 1975
Accession Number
ADD001948

Entities

People

  • Ronald D. Hall

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Beam Leads
  • Connectors
  • Patent Applications
  • Patents
  • Storage
  • Substrates
  • Terminals

Readers

  • Electrical Engineering
  • Nanofabrication and Microfabrication.
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene