Overlay Line Coupler.

Abstract

The patent application relates to a 90 degree directional coupler and a method of manufacturing therefor wherein the coupler is constructed on a planar microcircuit. The four 90 degree coupler ports are formed on one surface of a dielectric laminate having a metallic ground plane on the other surface thereof. Two diagonally opposite positioned ports are interconnected by a first coupling line formed on the surface of the substrate. A thin dielectric layer is then placed over the first coupling line and a second coupling line is placed over the thin dielectric layer such that it is substantially parallel to the first coupling line and such that it interconnects the other two diagonally opposite ports.

Document Details

Document Type
Technical Report
Publication Date
Dec 29, 1975
Accession Number
ADD002191

Entities

People

  • John Reindel

Organizations

  • United States Department of the Navy

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Couplings
  • Directional
  • Laminates
  • Manufacturing
  • Microcircuits
  • Patent Applications
  • Patents
  • Substrates

Fields of Study

  • Physics

Readers

  • Electrical Engineering
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics