Method for Making Beam Leads for Ceramic Substrates.

Abstract

The patent application describes a method for making beam leads for use in the interconnecting of electronic devices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.

Document Details

Document Type
Technical Report
Publication Date
Apr 02, 1976
Accession Number
ADD002599

Entities

People

  • Frank A. Lindberg

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Beam Leads
  • Connectors
  • Patent Applications
  • Patents
  • Substrates
  • Terminals

Readers

  • Electrical Engineering
  • Semiconductor Device Technology
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene