Process for Bonding with Polyethylene Encapsulant.

Abstract

A process for producing a bond at the interface between an encapsulant and the object to be encapsulated is provided. A selected resin with curing agent is coated and oven cured on the object to be encapsulated and thereafter a copolymer coating is applied to the assembly in a fluidized bed and the assembly is oven cured. The resulting product is then injection molded with a suitable polyethylene material. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 28, 1978
Accession Number
ADD005833

Entities

People

  • C. E. Vautrain Jr

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Assembly
  • Beds (Process Engineering)
  • Biomedical And Dental Materials
  • Chemical Reactions
  • Copolymers
  • Curing
  • Curing Agents
  • Dielectric Polymers
  • Films
  • Materials
  • Polymeric Films
  • Specialty Uses Of Chemicals

Fields of Study

  • Materials science

Readers

  • Nanocomposite Materials Science
  • Reinforced Composite Materials
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene