Solventless Amine Epoxy Resin System.
Abstract
A solventless amine-epoxy resin system which is made up of (1) a binary aromatic amine mixture of 2,6-diaminopyridine and meta-phenylene diamine in a weight ratio of from about 1:4 to about 4:1; and (2) an epoxy mixture of (a) the diglycidyl ether of bisphenol A, and (b) 1,4-butanediol diglycidyl ether in an amount sufficient to reduce the initial viscosity of the total amine-epoxy resin system to a value in the range of from about 500 to about 2000 cps at 25 C. The amount of aromatic amine mixture present in the amine-epoxy resin system is from about 0.90 to about 1.10 times the stoichiometric amount necessary to cure the epoxy mixture. The amine-epoxy resin systems of the present invention are used as the matrix for filament wound rocket and missile cases. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 22, 1977
- Accession Number
- ADD005855
Entities
People
- Elmer J. Rhyn
- George S. Handler
- James P. Diebold
- Kenneth R. Foote
Organizations
- United States Department of the Navy