Method of Making Integrated Waveguide Cavities.
Abstract
This invention provides a method for forming a waveguide cavity as a step in the process of diode fabrication. Semiconductor diodes are formed in a conventional manner. A plate of waveguide material having a thickness equivalent to waveguide height and slots corresponding to waveguide width is bonded to a semiconductor wafer containing a number of diodes. The slots are formed to correspond to rows of diodes, so that when bonded the diodes are centered in the slot. The package may then be divided as needed and the sides and thickness of the slot form the waveguide. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 04, 1980
- Accession Number
- ADD007130
Entities
People
- Chento Chao
Organizations
- United States Department of the Air Force