Improved Method of Infrared Laser Soldering.
Abstract
A method and apparatus for attaching miniaturized chip components to substrates is provided. The output of a 1.06 micron wavelength laser is aperturned or attenuated and the attenuated energy is monitored before passing through a cylinder lens which focuses and directs the energy to the intersection of the chip component and the substrate pad so that heat travel in the material is limited and soldering of narrow capacitor or component widths is permitted. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 23, 1979
- Accession Number
- ADD007148
Entities
People
- David R. Whitehouse
- Walter K. Cox
- William E. Prifli
Organizations
- United States Department of the Navy