Bonded Grid-Cathode Electrode Structure.

Abstract

A variety of technologies have been applied in the development of a bonded grid cathode. Erosion lithography is used for making the fine-detail grid structure, combining air erosion and lithographic techniques. To obtain openings of the order of 0.001 inch (one mil) or smaller, a nozzle with a high aspect ratio exit opening is used, and the cathode grid structure in scanned. A photo resist in which the grid pattern is developed is used over the molybdenum or tungsten grid film. The metal film is removed from the grid openings by chemical etching. The photo resist over the metal grid is used as a composite mask for removing the BN insulation in the openings by erosion with Al2O3 powder from the special nozzle on the air blast gun. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 12, 1980
Accession Number
ADD007589

Entities

People

  • David W. Oliver

Organizations

  • United States Army

Tags

DTIC Thesaurus Topics

  • Aspect Ratio
  • Chemical Etching
  • Composite Materials
  • Electrodes
  • Etching
  • Films
  • Insulation
  • Lithography
  • Metal Films
  • Metals
  • Molybdenum
  • Tungsten

Fields of Study

  • Physics

Readers

  • Combustion and Flow Dynamics.
  • Nanofabrication and Microfabrication.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene