Self-Aligned Recessed Gate with Low Source Resistance.

Abstract

A self-aligned recessed gate with low source resistance has an epitaxial structure with an n(+) contact layer. Source and drain contacts are put down, followed by resist spin-on and gate exposure. The gate channel is anodically thinned to expose the n active layer. The gate metal is evaporatively applied through the same resist opening which defines the gate channel. An insulating layer is laid down between the resist and the FET structure with ohmic contacts to prevent resist lifting, and a barrier layer is put over the ohmic contacts to provide insulating layer adhesion. The result is a sub-micron gate length FET having low source impedance. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 16, 1980
Accession Number
ADD008069

Entities

People

  • Clifford Nishimoto
  • Steve Gray Bandy

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Electronic Equipment
  • Electronics
  • Impedance
  • Metal-Semiconductor Junctions
  • Physical Properties
  • Resistance
  • Semiconductor Devices

Fields of Study

  • Materials science

Readers

  • Nanofabrication and Microfabrication.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene