Method of Chemically Vapor Depositing a Silicide Film.

Abstract

A film of a silicide of a refractory metal is chemically vapor deposited onto a substrate by placing a susceptor containing the substrate in a chemical vapor deposition reactor, flowing a compound of a refractory metal and a silicon bearing chemical diluted in nitrogen over the susceptor containing the substrate and heating the susceptor and substrate. The film is compatible with common integrated circuit techniques. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 17, 1981
Accession Number
ADD009122

Entities

People

  • Krishna C. Saraswat

Organizations

  • United States Army

Tags

DTIC Thesaurus Topics

  • Chemical Vapor Deposition
  • Circuits
  • Integrated Circuits
  • Metals
  • Nitrogen
  • Refractory Metals
  • Substrates
  • Vapor Deposition

Readers

  • Powder metallurgy of Titanium alloys.
  • Surface Engineering/Surface Coating Technology.