Thin Film Microstrip Circuits.

Abstract

A four layer thin film metallization system is comprised of layers of tantalum, chromium, copper and gold and is useful in high resolution, low loss microstrip circuits. The metallization system is compatible with lead-tin solder and, in addition, provides low insertion losses at X-band frequencies. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 08, 1982
Accession Number
ADD009675

Entities

People

  • R. D. Hall

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Chromium
  • Films
  • Frequency
  • High Resolution
  • Insertion Loss
  • Losses
  • Tantalum
  • Thin Films
  • X Band

Readers

  • Microwave Engineering.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene