Refractory Ohmic Contacts to GaAs and the Method of Making Same.

Abstract

The present invention is directed in general to novel ohmic contacts with gallium arsenide (GaAs) electronic devices utilizing refractory metals to form the contacts and to a novel method of making these contacts. Low specific contact resistance ohmic contacts to N-type GaAs using epitaxial germanium (Ge) films formed by molecular beam epitaxy and vacuum epitaxy are known in the art. Theoretically, the epitaxial Ge film allows the formation of contacts with a uniform N layer, in the highly doped Ge film itself or from Ge doping of the GaAs. In theory such contacts should be more nearly free of imperfections compared to polycrystalline Ge or AuGe eutectic films in which rapid impurity diffusion occurs at grain boundaries.

Document Details

Document Type
Technical Report
Publication Date
Mar 25, 1982
Accession Number
ADD009915

Entities

People

  • Bernard L. Lewis

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Boundaries
  • Diffusion
  • Elements
  • Epitaxial Growth
  • Gallium
  • Gallium Arsenides
  • Germanium
  • Grain Boundaries
  • Impurities
  • Inventions
  • Metal-Semiconductor Junctions
  • Metals
  • Molecular Beam Epitaxy
  • Molecular Beams
  • Polycrystals
  • Refractory Metals

Fields of Study

  • Materials science

Readers

  • Powder metallurgy of Titanium alloys.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene