Damping Package for Surface Acoustic Wave Devices.

Abstract

This invention relates generally to surface acoustic wave (SAW) devices, and more particularly to the elimination or minimization of bulk waves in such devices. Surface acoustic wave devices, including convolvers and filters, may have bulk modes induced in addition to the desired surface wave. Such bulk modes produce spurious responses which denigrate the usefulness of these devices. The crystal substrate of a surface acoustic wave device is provided with a backing layer on its lower surface. This backing layer is fabricated to have approximately the same acoustic impedance as the substrate for the bulk modes of concern, but is of an acoustically lossy material. Such a backing layer may be fabricated, for example, from tungsten powder and powdered vinyl.

Document Details

Document Type
Technical Report
Publication Date
May 09, 1983
Accession Number
ADD010284

Entities

People

  • Jeffrey H. Goll

Organizations

  • United States Army

Tags

DTIC Thesaurus Topics

  • Acoustic Impedance
  • Acoustic Waves
  • Impedance
  • Substrates
  • Surface Acoustic Wave Devices
  • Surface Acoustic Waves
  • Surface Waves
  • Waves

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Microwave Engineering.