Hermetic Chip Carrier Compliant Soldering Pads.

Abstract

Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1985
Accession Number
ADD011722

Entities

People

  • Hemler

Organizations

  • United States Department of the Air Force

Tags

DTIC Thesaurus Topics

  • Coefficients
  • Discontinuities
  • Joining
  • Soldering
  • Thermal Expansion

Readers

  • Control Systems Engineering.
  • Electrical Engineering
  • Pavement Materials Engineering.