Non-Contact Polishing.

Abstract

A non-contact polishing apparatus is used for polishing semiconductor planar substrates. The substrate is set back from any surface and is held by a chuck fixed within a collar. This substrate holder assembly is placed within an enclosed container that has a non-abrasive solution therein. The container is mounted to a high speed nutating table that provides random motion to the holder assembly. This action provides isotropic polishing with no polishing created defects on the substrate surface.

Document Details

Document Type
Technical Report
Publication Date
Jan 15, 1986
Accession Number
ADD012210

Entities

People

  • Brian S. Ahern

Organizations

  • United States Department of the Air Force

Tags

DTIC Thesaurus Topics

  • Abrasives
  • Assembly
  • Carbides
  • Chemical Compounds
  • Compound Semiconductors
  • Containers
  • Electronics
  • Inorganic Carbon Compounds
  • Inorganic Chemicals
  • Polishing
  • Semiconductors
  • Solid State Electronics
  • Substrates

Readers

  • Electrical Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems