Metallization for Hermetic Sealing of Ceramic Modules.

Abstract

A superior hermetic seal for ceramic modules is presented. The case base member is provided with metallization around the periphery of the cavity. The case cover is provided with metallization not only to mate with the metallization of the base, but the cover metallization extends onto the thickness edge. The dimensions of the cover are less than the corresponding metallization dimensions of the base member. In this manner the solder bead formed about the periphery will wet the exposed metallization surfaces and form a visually inspectable bead.

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1986
Accession Number
ADD012483

Entities

People

  • Hayden Morris
  • Henry W. Rhodes
  • Margaret C. Marlow

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Boundaries
  • Geometry
  • Hardware (Mechanical)
  • Hermetic Seals
  • Mathematics
  • Physical Properties
  • Thickness

Readers

  • Facility/Structural Engineering.
  • Integrated Circuit Design and Technology.
  • Polymer Science and Engineering.