Manual Microcircuit Die Test System.

Abstract

A system for testing semiconductor microchips is provided in which individual microchips can be tested electrically and under specific thermal conditions simultaneously to determine the reliability of the microchip under operating conditions. This system is unique and economically operable so as to enable all individual chips to be tested prior to mounting in larger assemblies. Patent applications. (RH)

Document Details

Document Type
Technical Report
Publication Date
Oct 27, 1988
Accession Number
ADD013930

Entities

People

  • Bernard E. Martin
  • Daron C. Holderfield
  • Samuel S. Russell

Organizations

  • United States Army

Tags

DTIC Thesaurus Topics

  • Assembly
  • Compound Semiconductors
  • Electronics
  • Integrated Circuits
  • Metal Oxide Semiconductors
  • Microcircuits
  • Patent Applications
  • Patents
  • Reliability
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems