Fluorinated Epoxy Resins with High Glass Transition Temperatures.
Abstract
An object of this invention is to provide a fluoroepoxy resin with a high glass transition temperature. And, an object of this invention is to provide a fluoroepoxy resin for use in computer composite circuit boards. Also, an object of this invention is to provide a fluoroepoxy resin which will withstand a processing temperature of 250C and an operating temperature of 100C. Further, an object of this invention is to provide a curing agent for epoxy resins which will increase the glass transition temperature of these resins. These and other objects are accomplished by a 'glassy state' curing agent containing a monoanhydride and a dianhydride which when mixed with an epoxy resin produces a polymer with higher crosslink densities, resulting in higher glass transition temperatures. Keyword: Patent applications (AW)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 27, 1989
- Accession Number
- ADD014159
Entities
People
- James R. Griffith
Organizations
- United States Department of the Navy