A Method of Soldering Aluminum.

Abstract

This invention relates to methods of joining metal parts and more particularly to methods of soldering aluminum. Accordingly an object of this invention is to provide a new method of soldering aluminum and its alloy. Another object of this invention is to provide treated aluminum surfaces which can easily be soldered. These and other objects of this invention are accomplished by providing a process comprising: (1) wetting an aluminum or aluminum alloy surface with molten silver nitrate; (2) heating the AgNO3 coated aluminum surface at a temperature of from the decomposition temperature of AgNO3 to about 550 C to decompose the AgNO3 and form a Ag metal film. Patent applications. (JES)

Document Details

Document Type
Technical Report
Publication Date
Aug 29, 1989
Accession Number
ADD014226

Entities

People

  • A. P. Divecha
  • P. Hesse
  • S. Karmarkar
  • W. A. Ferrando

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Alloys
  • Aluminum
  • Aluminum Alloys
  • Decomposition
  • Films
  • Inventions
  • Joining
  • Metal Films
  • Metals
  • Patent Applications
  • Patents
  • Silver Compounds
  • Soldering

Readers

  • Electrical Engineering
  • Metallurgy
  • Thin Film Deposition Science.