Method of Joining Diamond Structures.

Abstract

This invention relates to diamond materials and more particular to methods of bonding diamond pieces together. Diamond is the ideal material for a large number of applications. Diamond is highly transparent to infrared radiation (IR) and radar, has the highest known heat conductivity, highest known hardness, produces little friction, does not conduct electricity, etc. Thus, diamond has properties that make it desirable as structural material for many applications, including radomes. Patent applications.

Document Details

Document Type
Technical Report
Publication Date
Jul 08, 1991
Accession Number
ADD015066

Entities

People

  • John Barkyoumb
  • Lawrence T. Kabacoff

Organizations

  • United States Department of the Navy

Tags

DTIC Thesaurus Topics

  • Absorbers (Materials)
  • Advanced Materials
  • Conductivity
  • Electricity
  • Electromagnetic Radiation
  • Engineered Materials
  • Friction
  • Hardness
  • Infrared Radiation
  • Inventions
  • Ionizing Radiation
  • Materials
  • Patent Applications
  • Patents
  • Radiation
  • Thermal Conductivity

Readers

  • Electrical Engineering
  • Semiconductor Device Technology
  • Surface Coatings Technology.