Adhesion of Silicon Oxide to Diamond.
Abstract
An electronic semiconductor device has a capability for storing a charge, is non-responsive to visible light and has a low leakage. The device is includes a diamond substrate which is securely adhered to a robust layer of silica layer that cannot be scratched by a tungsten probe or delaminated from the diamond substrate by pulling on a gold wire secured to the silica layer. This electronic device can be made by electrochemically cleaning the diamond substrate to remove non-diamond carbon adhering thereto, depositing a fragile layer of silica layer which weakly bonds to the cleaned diamond, and annealing the fragile silica layer to convert it into a strongly bonded and robust silicon dioxide layer.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 22, 1993
- Accession Number
- ADD016356
Entities
People
- Michael J. Marchywka
Organizations
- United States Department of the Navy