Adhesion Enhancement for Underplating Problem.
Abstract
Underplating between a metallic plating base and a photoresist deposited thereon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of: (a) depositing a plating base on the adhesion layer; (b) depositing on the plating base a sacrificial layer of a material that reduces or eliminates underplating on the plating base compared to underplating in absence of the sacrificial layer; (c) depositing a photoresist on the sacrificial layer; (d) exposing, developing and removing the exposed photoresist from the substrate to uncover a portion of the sacrificial layer; (e) removing the sacrificial layer portion from the substrate to uncover a portion of the plating base; and (f) depositing a metallic material on the uncovered plating base under the influence of electrical current. jg p23
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 31, 1996
- Accession Number
- ADD017844
Entities
People
- Robert W. Mcelhanon
- William K. Burns
Organizations
- United States Department of the Navy