Heat-Resistant Electronic Systems and Circuit Boards with Heat Resistant Reinforcement Dispersed in Liquid Metal
Abstract
A heat resistant system have electronic circuit components fusion bonded onto a circuit board substrate with a heat-resistant composite material. The composite material consists essentially of a solid heat-resistant reinforcement dispersed in a liquid metal matrix of the composite material. The heat-resistant reinforcement differs in density by substantially uniformly and stably distribute in the liquid composite matrix, with substantially no tendency to either sink down or float up therein. This stably uniform distribution enures improved uniformly, reproducibility and heat resistance of the circuit board.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 07, 2002
- Accession Number
- ADD020044
Entities
People
- Chou H. Li
Organizations
- United States Department of the Navy