Curing Urea-Formaldehyde Adhesives in Thick Particleboard Mats,

Abstract

A review of literature regarding high frequency heating of composition board mats is presented. Results of a study involving high frequency heating at the hot press, with high frequency heating begun after press closing, are also discussed. Uniform-density boards were obtained at lower platen temperatures. These boards had soft, rough surfaces and inferior bending properties. At 325deg F (163deg C) platen temperature high frequency heated boards had density distributions comparable to those of boards produced by straight-forward contact heating at equal platen temperature.

Document Details

Document Type
Technical Report
Publication Date
Sep 25, 1980
Accession Number
ADP002442

Entities

People

  • C. Carll

Organizations

  • Forest Products Laboratory

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Composition Board
  • Formaldehyde
  • Frequency
  • Frequency Bands
  • Literature
  • Radio Frequency
  • Wisconsin

Fields of Study

  • Materials science

Readers

  • Forest Ecology
  • Polymer Science and Engineering.
  • Thermal Physics or Thermal Science.