Improving SMT (Surface Mount Technology) Circuit Board Inspection with 3D Vision,

Abstract

Automated inspection has been a topic of great interest for the past several years, particularly when it addressed surface mount technology (SMT). While SMT makes smaller, lighter, more capable products possible, SMT also makes assembling circuits more challenging. With closer contact spacings, complex device packages, and many contacts under the devices themselves, automated SMT assembly has become a necessity. Robots or dedicated machines place components automatically on substrates. In turn, these substrates are wave or reflow soldered with automated equipment. However, inspection automation has not kept up with progress in automated component placement and soldering. This paper explores the reasons for the lag in automating inspection, and suggests a solution using 3D vision and quantitative quality models similar to those used by inspection personnel. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1987
Accession Number
ADP005186

Entities

People

  • Mike Juha

Tags

Communities of Interest

  • Autonomy
  • Human Systems

DTIC Thesaurus Topics

  • Assembly
  • Automation
  • California
  • Circuit Boards
  • Electronic Equipment
  • Electronics
  • Inspection
  • Manufacturing
  • Mass Production
  • Soldering
  • Substrates

Readers

  • Electrical Engineering
  • Robotics and Automation.
  • Systems Analysis and Design

Technology Areas

  • AI & ML
  • AI & ML - Machine Translation
  • Autonomy
  • Space
  • Space - Spacecraft Maneuvers