Accelerated Aging and Solderability Testing of Printed Wiring Boards,
Abstract
There is presently much industry activity related to solderability testing. Test methods, test parameters, and accelerated aging conditions are among the items being studied. But the bulk of the activity relates to component terminations, and not to printed wiring boards (pwb). At Rockwell International's Collins Defense Communications, test programs related to pwb aging and solderability have been ongoing for several years. Data from natural aging and from a variety of accelerated test methods have been compared. Results from several solderability test methods have also been compared. Recommendations are made for an accelerated aging method and for solderability testing of pwb's. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1987
- Accession Number
- ADP005190
Entities
People
- James R. Wooldridge
- John C. Mather