Today and Tomorrow in Soldering,
Abstract
Improvements are achieved in solderability for the old Plated-Through-Hole (PTH) Technology. The Military Specifications, general rules, and attitudes required to achieve solderable leads are in place with a majority of manufacturers. This paper describes the status of lead solderability quality for PTH assemblies, and what must be done stay on the right track and to maintain the momentum developed at much effort and expense. In the future, Surface Mount Technology (SMT) will certainly be predominant. This paper covers the potential pitfalls in SMT applications.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1987
- Accession Number
- ADP005195
Entities
People
- Alan Burkett
- Barbara Waller
- Bill Russell
- Mike Wolverton
- Roy Yenawine
Organizations
- Texas Instruments