SMD Soldering Technology Development at Government Systems Operations, Control Data Corporation,
Abstract
A general discussion dealing with the design for manufacturability and manufacturing of surface mount assemblies will be addressed, including the development of the soldering of surface mount leadless, and fine-pitch, high-lead-count, gull wing chip carriers. Product design and manufacturing processes are predominantly driven to meet the requirements for advanced military computers. SMD soldering technology developed with the Navy's sponsored program, CIRCUIT CARD ASSEMBLY AND PROCESSING SYSTEM (CCAPS), methodology.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1987
- Accession Number
- ADP005200
Entities
People
- Deepak K. Pai
Organizations
- Control Data Corporation