Lessons Learned in Testing Solderability of Integrated Circuits Using Method 2003 of MIL-STD-883,
Abstract
The paper will cover the recent history of changes in lead finish of integrated circuits and method 2003 of Mil-Std-883C. It will cover the changes in the various parts of Method 2003 and the impact of these changes in detecting solderability problems of Integrated Circuits. It will also cover the sensitivity of the sampling plans used in Method 2003 and how sensitive these sampling plans are in detecting solderability problems. It will discuss some of the defects associated with solderability problems. It will show that if Method 2003 is not performed correctly that the integrated circuits check the technique used in implementing the method rather than the method checking the solderability of the units. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1987
- Accession Number
- ADP005201
Entities
People
- Buford G. Slay
Organizations
- Texas Instruments