Development of a Semi-Automated Machine for Repair of Surface Mounted Printed Circuits,

Abstract

The major problem areas in removal and replace of surface mount devices, especially those with fine pitch and high lead counts, and the capabilities required to solve those problems are discussed. The major problem areas are solder reflow of surface mount devices (SMDs) without damage to the device itself or adjacent devices and solder joints, accurate pick and place, controllability of the important parameters in the repair process, and flexibility in dealing with different devices. The design of a machine which addresses these problems, the SRM-100, is described. The SRM-100 achieves an RMS placement repeatability of 0.0016 inches, and demonstrates the ability to reflow SMD solder joints while maintaining the device center and adjacent devices and solder joints at a low enough temperature to prevent damage. All important parameters are controlled by a microprocessor and are stored in nonvolatile memory as repair cycles which may be called up by the operator. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1987
Accession Number
ADP005202

Entities

People

  • Donald J. Spigarelli
  • William F. Drislane

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • California
  • Circuits
  • Electronics
  • Manufacturing
  • Microprocessors
  • Nonvolatile Memories
  • Printed Circuits
  • Resilience
  • Robots

Readers

  • Adaptive Control and Estimation with Uncertainty in Dynamic Systems.
  • Electrical Engineering
  • Logistics and Supply Chain Management.