Arsenic Passivation of Silicon by Photo-Assisted Metalorganic Vapour Phase Epitaxy,

Abstract

The MOVPE deposition of semiconductors requires effective substrate surface preparation, especially where low temperature, photo-assisted growth is involved. Ideally this process should be achieved in situ in the growth reactor immediately prior to deposition. In a previous paper we reported the in situ removal of carbon from Si and GaAs substrate surfaces using 193nm radiation in a 1 Torr 02 ambient. This process generates a thin oxide which can then be removed by annealing at 850 deg C, although the process does not always go to completion. To protect the cleaned surface and to passivate the silicon substrate prior to deposition of GaAs we have explored the arsenic passivation techniques developed by Bringans. The oxidation resistance of surfaces prepared this way is also sufficient to permit transfer between laboratories for collaborative studies.

Document Details

Document Type
Technical Report
Publication Date
May 22, 1992
Accession Number
ADP007930

Entities

People

  • A. W. Vere
  • D. C. Rodway
  • K. J. Mackey
  • P. C. Smith

Organizations

  • Royal Signals and Radar Establishment

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Annealing
  • Buildings And Structures
  • Chemical Compounds
  • Compound Semiconductors
  • Electronics
  • Low Temperature
  • New Mexico
  • Oxidation
  • Oxidation Resistance
  • Oxides
  • Radiation
  • Research Facilities
  • Resistance
  • Semiconductors
  • Solid State Electronics
  • Substrates

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene