Influence of Covering on Critical Thickness of Strained In(x)Ga(1-x)As Layer

Abstract

This study examined the critical layer thickness (CLT) of mismatched epitaxial layers and strained heterostructures. Samples consisting of In(x)Ga(1-x)As/InP and In(0.52)Al(0.48)As/In(x)Ga(1-x)As/In(0.52)Al(0.48)As/InP were grown on Indium Phosphorus (InP) substrates by low pressure metalorganic vapor phase epitaxy (LP-MOVPE). Atomic force microscopy (AFM) was used to observe misfit dislocation generation. When the layer is buried in the heterostructure, its critical layer thickness increases. These investigations have shown how many times this value may be exceeded in chosen technological conditions. A model was proposed that explains the difference between CLT of Indium Gallium Arsenides (InGaAs) with free surface and CLT of buried InGaAs. Heterostructures mentioned above were employed for producing InAlAs/InGaAs/InP HEMT transistors. (2 tables, 3 figures, 10 refs.)

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 03, 2002
Accession Number
ADP013778

Entities

People

  • Agata Jasik
  • Kamil Kosiel
  • Marek Wesolowski
  • Wlodzimierz Strupinski

Organizations

  • Institute of Electronic Materials Technology

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Coverings
  • Crystal Lattices
  • Dislocations
  • Electron Mobility
  • Electronic Mail
  • Electronic Materials
  • Electrons
  • Films
  • Heterojunctions
  • Mass Spectrometry
  • Materials
  • Subatomic Particles
  • Substrates
  • Surface Roughness
  • Technical Information Centers
  • Thickness
  • Two Dimensional

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene