Indirect Fire and Fuze Technology

Abstract

The Indirect Fire and Fuze Technology Project includes product improvement development efforts to upgrade indirect fire weapon systems and munitions that have already been fielded and/or are in production. Initiatives include improved target engagement, increased reliability, availability, maintainability, and safety, standardization and interoperability with weapons and munitions of Allied Nations, defense exportability features, reduction of failure mechanisms, and supply chain risk through introduction of new and alternative technology and materiel solutions, improvement of manufacturing methods and their associated production and life cycle support processes, new capabilities in response to the evolving and emerging threats and countermeasures, and reduction/elimination of potential environmental and health risks associated with these products. Fiscal Year (FY) 2023 funding will support Fuze Technology Integration (FTI) efforts to complete conventional artillery fuze evaluations for compatibility with Long Range Precision Fire (LRPF) projectiles; expand and refine the fuze critical components database to identify and mitigate obsolescence as well as single point components and processes; develop and evaluate M734A1 mortar fuze custom application specific integrated circuit (ASIC) signal processor and accelerometer; complete implementing the M739A1/M782 artillery fuze setback mass drop safety improvement; continue integrating electronic and energetic technologies into the M213 hand grenade fuze to increase fuze and explosive safety; continue maturing extended duration artillery fuze power sources; support M783 mortar fuze evaluation, design improvement and testing to preclude early fuze functioning; evaluate miniature reserve cell batteries for use in 30mm to 40mm medium caliber fuzes.

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Document Details

Document Type
Project
Publication Date
Oct 01, 2023
Source ID
ER5_0607131A_7_2040_PB_2023

Tags

Readers

  • Integrated Circuit Design and Technology.
  • Munitions and Ordnance Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems

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